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Major material: FR-4, Nelco, HTG>170, High CTI value, halogen free Minimum board thickness: Double sided: 0.2mm Multilayer: 0.4mm Maximum board thickness: Double sided: 2.4mm Multilayer: 3.2mm Surface finishing: HAL Lead-free HAL Flash gold Selective Gold Immersion gold (ENIG) Immersion tin Immersion silver Carbon print Gold fingers Entek (OSP) Flux coating Peelable mask Gold Plating (hard gold) ENIG thick Gold Solder mask plugged hole Copper finished thickness: 1/2 oz to 6 oz Minimum hole size: 0.25mm Minimum line width/***cing: 0.1 Standard: RoHS, SGS, UKAS, ISO14001, DNV, UL
We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity |
Company: |
Oak Cream Co., Ltd
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Contact: |
Ms. Rika Lee |
Address: |
Lutian Road |
Postcode: |
410025 |
Tel: |
(+86)731-82789286 |
Fax: |
(+86)731-82858196 |
E-mail: |
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